India's first advanced 3D glass chip packaging unit to be set up in Bhubaneswar with Rs 1,943 crore investment, boosting ...

US-based 3D Glass Solutions (3DGS), through its wholly owned Indian subsidiary Heterogenous Integration Packaging Solutions Pvt Ltd (HIPSPL), is implementing a greenfield, vertically integrated ...

Completing Task 4 of the U.S. Navy’s 10-MW Advanced Circuit Breaker Development Program, Menlo Micro has demonstrated the ...

Antenna Market to Reach $60.4 Billion by 2032 new study on the Antenna Market published unanimously by Allied Market Research ...

The second edition of Inc42's Manufacturing Startups to Watch comprises names like Anmaya Technologies, Bacancy Systems, Maraal Aerospace, Pace Robotics, and Silizium Circuits.

Strategic investment strengthens VisionWave's position in AI-driven sensing, robotics and defense applications.

VisionWave Holdings, Inc. (Nasdaq: VWAV) today announced a signed non-binding term sheet for a strategic investment in Foresight Autonomous Holdings Ltd. (Nasdaq: FRSX), under which VisionWave will ...

US-based 3D Glass Solutions, via its Indian subsidiary, is building a greenfield advanced packaging facility in Odisha with a ...

The strategic equity investment reflects a multiple of three times of Foresight’s current market value to reach a post investment valuation of ...

Odisha breaks ground on 3D Glass Solutions advanced glass chip packaging unit; State eyes top-tier semiconductor hub status ...

Odisha took a major leap into the global semiconductor value chain on Sunday as Chief Minister Mohan Charan Majhi performed the groundbreaking for 3D Glass Solutions Inc.'s (3DGS) advanced chip ...

Shares Strategy, Acquisition And Revenue Update. Investorideas (Investorideas Newswire) a top 100 rated investment site for retail Investors following AI and defense stocks, reports on breaking news ...