Rambus announces SOCAMM2, a new chipset enabling low power, high performance LPDDR5X-based memory modules for next gen AI ...

Rambus has launched a SOCAMM2 chipset designed to support power‑efficient, high‑performance LPDDR5X memory modules in AI ...

SK hynix Inc. (or "the company", announced today that it has begun mass production of the 192GB SOCAMM2, a next-generation memory module standard based on the 1cnm process (sixth-generation of the 10 ...

SK hynix said Monday it has begun mass production of a next-generation memory module designed for AI servers, as it seeks to ...

The JEDEC Solid State Technology Association has officially detailed the preliminary specifications for the LPDDR6 memory standard. Designed ...

EXPO 1.2 keeps CUDIMM in bypass mode on AM5 for now, with full speed support and complete compatibility expected to arrive ...

Memory module maker Apacer Technology reported its consolidated financial results for the first quarter of 2026, with revenue ...

JEDEC is nearing the completion of an LPDDR6 Processing-in-Memory (PIM) standard. Essentially, by baking processing capabilities directly into the memory itself, this tech reduces the need to ...

Rambus Inc. (NASDAQ:RMBS) announced Wednesday a SOCAMM2 chipset designed to enable low-power, high-performance LPDDR5X-based ...

SK hynix continues development of next-generation DRAM and AI memory solutions, targeting improved efficiency and performance ...

On April 17, Security Times reported that Beijing New Space-time Technology (Time Space Technology) plans to acquire Shenzhen ...

SK hynix, the world's second-largest memory chipmaker, said Monday it had begun mass production of 192 GB memory modules, ...