MarketWatch

Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach

-- Imec presents the first comprehensive thermal study of 3D HBM-on-GPU integration using a system-technology co-optimization (STCO) approach. -- The study allows to identify and mitigate thermal ...
DATAQUEST

Cadence announces collaboration with Intel Foundry to accelerate Intel 14A process optimization for HPC and mobile designs

The collaboration with Intel will also leverage Cadence’s agentic AI flows and core products to accelerate time-to-market and ...
Hosted on MSN

Imec pushes 3D HBM-on-GPU technology to extreme limits

3D HBM-on-GPU design reaches record compute density for demanding AI workloads Peak GPU temperatures exceeded 140°C without thermal mitigation strategies Halving the GPU clock rate reduced ...
T&D

Minimize Total System Costs with Co-Optimization

Co-optimizing generation and transmission in a single model endogenously identifies the least-cost mix of grid enablement and generation resources. Over a 15 to 20-year horizon, where compounding ...
Missoulian

Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach

Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures ...